This research report presents forecast and recent quarter review of the worldwide motherboard application IC market. The report includes motherboard shipment volume and breakdowns by CPU supplier, CPU connector type, chipset supplier, and chipset type. The content of this report is based on primary data obtained through interviews with motherboard component makers. The report finds that after witnessing a sequential decline in the second quarter of 2011, the worldwide motherboard shipment volume enjoyed both sequential as well as year-on-year growth in the third quarter of 2011. It is observed that LGA775 remained the dominant CPU connector type in the third quarter of 2011. It is anticipated that the growth momentum recorded in the third quarter of 2011 will slow down in the fourth quarter of 2011, and the worldwide motherboard shipment volume will continue to experience shipment decrease in the first quarter of 2012.